Coupled Data Communication Techniques for High Performance and Low-Power ComputingThis book describes that
proximity connections are fast and it occupies small area and consume little energy. Proximity
communication permits one to replace chips in a big system. Together, quality and replacement make wafer-scale integration possible. A complete system could serve as a jig that would test fresh chips in their real environment.Huge potential for replacement to simplify and improve test may permit a profound change in the business alliances that produce products, according to the author. Without the ability to replace, one
bad chip destroys an entire multi-chip module, making specialization in module assembly a poor business.
Part I Introduction1 Introduction to Coupled Data Technologies (Ron Ho, Robert Drost)1.1 Life has been good 1.2 Faster computers tomorrow 1.2.1 The end of Moore’s Law 1.2.2 The arguments against–and for–multiple chips 1.3 Coupled data communication1.3.1 This book
Part II Overview of 3D Technologies2 Power delivery, signaling and cooling for 2D and 3D integratedsystems (Muhannad Bakir, Gang Huang and Bing Dang)2.1 Introduction2.2 Evolution of conventional silicon ancillary technologies: A brief overview 2.3 Novel silicon ancillary technologies2.3.1 Optical I/Os2.3.2 Fluidic I/Os for single and 3D chips2.4 Power delivery for 2D and 3D systems 2.4.1 Power delivery and design implications of 2D systems2.4.2 Power delivery and design implications of 3D systems
3 Capacitive Coupled Communication(David Hopkins, Alex Chow, Frankie Liu, Dinesh D. Patil, Hans Eberle)3.1 Introduction 3.2 An electrical model of capacitive interchip communication 3.2.1 Crosstalk mitigation3.2.2 Simulation results3.3 Transmitting data3.4 Receiving data3.4.1 Attenuation 3.4.2 Loss of DC information 3.4.3 Comparators3.4.4 Receiver sizing 3.4.5 Timing schemes3.5 Two-dimensional arrays3.6 Measurement results3.6.1 Voltage waterfall3.6.2 Timing waterfall 3.6.3 Combined eye diagram 3.6.4 BER versus chip separation3.7 Prototype application: a high-radix switch
4 Inductive Coupled Communications (Noriyuki Miura, Takayasu Sakurai, and Tadahiro Kuroda)4.1 Introduction 4.2 Inductive-coupling channel 4.2.1 Overview of channel characteristics4.2.2 Range extendability4.2.3 Coupling strength through Si substrate4.2.4 Crosstalk4.3 Inductive-coupling transceiver4.3.1 Signaling4.3.2 Coil design 4.3.3 Transceiver circuit design 4.3.4 Inter-chip communications4.4 Power reduction techniques4.4.1 Pulse shaping4.4.2 Daisy chain transmitter4.5 High-speed techniques4.5.1 Asynchronous transceiver4.5.2 Burst transmission 4.6 Crosstalk reduction techniques 4.6.1 Time interleaving4.7.1 Homogenous chip stacking4.7.2 Inductive-coupling up/down repeater4.7.3 Test chip measurement 4.8 Application II: processor and memory stacking 4.8.1 Heterogenous chip stacking 4.8.2 Interface design 4.8.3 Test chip measurement4.9 Conclusion
5 Use of AC Coupled Interconnect in Contactless Packaging(Paul Franzon)5.1 Introduction: Why use ACCI?5.1.1 Chapter outline 5.2 Historical Perspectives5.3 Capacitively Coupled Chip I/O 5.3.1 Capacitively Coupled Channel Design5.3.2 ACCI Circuits5.3.3 ACCI Packaging 5.4 Mid-channel Capacitively Coupled Structures5.5 Inductively Coupled Connectors and Sockets 5.6 Conclusions and Future Perspectives
Part IV Enabling Coupled Data Technologies6 Aligning chips face-to-face for dense capacitive communication(John E. Cunningham, Ashok V. Krishnamoorthy, Ivan Shubin, JamesG. Mitchell, Xuezhe Zheng)6.1 Introduction6.2 Aligning chips face-to-face6.2.1 Power and ground connections between coupled chips6.3 A low-cost package for capacitive proximity communication 6.4 Array packages using bridge chips
Part V Extending Data Coupling Technologies
7 Delivering On-chip Bandwidth Off-chip and Out-of-box withProximity and Optical Communication Ashok V. Krishnamoorthy, Jon Lexau, Xuezhe Zheng, John E.Cunningham7.1 Introduction7.2 Photonics as a long-reach interconnect4.6.2 Differential coil4.7 Application I: memory stacking7.5 Test chip results7.6 Conclusion
8 AC Coupled Wireless Power Delivery(Makoto Takamiya, Kohei Onizuka, and Takayasu Sakurai)8.1 Three dimensional stacked inter-chip wireless power delivery8.2 Prototype of wireless power transmission circuits8.3 Theoretical analysis and circuit improvementsThank you for visiting this site! If you like the post, please feel free to show your comments or be a member of this site by signing up in the left side of the content!!
This book
Sliding Mode Control in Engineering is another creation of the author for outstanding entry to
Dekker's Control Engineering. This is to address the applications aspects of control
engineering, stress applications issues, provide texts that present not only both new and well-established techniques, but also detailed examples of the application of these methods to the solution of real world problems, relevant applications sectors, and exciting examples of the application of control techniques in the established fields of electrical, mechanical (including aerospace), and chemical
engineering.
Chapter 4 deals with observer design for a large class of nonlinear systems
.Chapter
5 presents a complementary point of view concerning the design of dynamical output controllers, instead of observer and state controllers.
Chapter 6 presents the link between three of the most popular nonlinear control methods (i.e., sliding mode, passivity, and flatness) illustrated through power converter examples.
Chapter 7 is dedicated to stability and stabilization. The domain of sliding mode motion is particularly investigated and the usefulness of the regular form is pointed out.
Chapter 8 recalls some problems due to the discretization of the sliding mode controller. Some solutions are recalled and the usefulness under sampling of the higher-order sliding mode is highlighted.
Chapter 9 deals with adaptive control design. Here, some basic features of control algorithms derived from a suitable combination of sliding mode and adaptive control theory are presented.
Chapters 10 and 11 are dedicated to time delay effects. They deal, respectively, with relay control systems and with changes of behavior due to the delay presence.
Chapter 12 is dedicated to the control of infinite-dimensional systems. A disturbance rejection for such systems is particularly presented. In order to increase interest in the proposed methods, the book ends with two applicative fields.
Chapter 13 is dedicated to robotic applications
Chapter 14 deals with sliding mode control for induction motors
Thank you for visiting this site! If you like the post, please feel free to show your comments or be a member of this site by signing up in the left side of the content!!
Nanopackaging- Nanotechnologies and Electronics PackagingThe book is all about
Nanotechnologies and Electronics Packaging. Packaging is the final manufacturing process transforming semiconductor devices into functional products. This provides electrical connections for signal transmission, power input, and voltage control, thermal dissipation and the physical protection required for reliability. Packaging governs the size, weight, and shape of the end product. Materials are at the heart of packaging technology. Packaging material contributes significantly to the packaged device performance, reliability and workability as well as to the total cost of the package. Nanomaterials and nanotechnologies promise to offer significant solutions towards packaging technology challenges in coming years. Carbon nanotubes (CNTs), nanowires and nanoparticles, have shown unique electrical, thermal, and mechanical properties orders of magnitude superior to current packaging materials used today.
Nanotechnologies and Electronics Packaging is the result of depth reviews written by some of the leading practitioners in the field. It covered the broad aspects of the field from materials preparations, materials properties, surface modifications, engineering applications, mathematical simulations. The editor of this book is a member of the IEEE Nanotechnology Council. Chap. 1- introduced the scope of the field with a literature survey.Chap. 2 - backed up with multiple examples of nanoscale modeling in packaging, present and future, including nanoimprinting, solder paste printing, microwave heating, underfill, and anisotropic conductive film. Nanoparticle fabrication is introduced in Chapter 3 -. 4 both focus on the molecular modeling technique, especially for interfacial characterization, with applications to carbon nanotube (CNT) thermal performance, moisture diffusion and thermal cycling, and delamination failures.
Chap. 5 - introductions to melting point depression, the coulomb block, interface diffusion effects, optical absorption, sintering, etc.
Chap. 6 - Nanoparticle fabrication is introduced.
Below are the table of contents:1 Nanopackaging: Nanotechnologies and Electronics Packaging .......... 1
2 Modelling Technologies and Applications ............................................. 15
3 Application of Molecular Dynamics Simulation
in Electronic Packaging ........................................................................... 39
4 Advances in Delamination Modeling ..................................................... 61
5 Nanoparticle Properties .......................................................................... 93
6 Nanoparticle Fabrication ........................................................................ 109
7 Nanoparticle-Based High-k Dielectric Composites:
Opportunities and Challenges ................................................................ 121
8 Nanostructured Resistor Materials ........................................................ 139
9 Nanogranular Magnetic Core Inductors: Design, Fabrication,
and Packaging .......................................................................................... 163
10 Nanoconductive Adhesives .................................................................... 189
11 Nanoparticles in Microvias ................................................................... 209
12 Materials and Technology for Conductive Microstructures .............. 239
13 A Study of Nanoparticles in SnAg-Based Lead-Free Solders ............ 265
14 Nano-Underfills for Fine-Pitch Electronics ......................................... 287
15 Carbon Nanotubes: Synthesis and Characterization ......................... 325
16 Characteristics of Carbon Nanotubes
for Nanoelectronic Device Applications ............................................... 345
17 Carbon Nanotubes for Thermal Management of Microsystems ....... 377
18 Electromagnetic Shielding of Transceiver Packaging
Using Multiwall Carbon Nanotubes ..................................................... 395
19 Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders
Reinforced With Single-Wall Carbon Nanotubes ............................... 415
20 Nanowires in Electronics Packaging .................................................... 441
21 Design and Development of Stress-Engineered
Compliant Interconnect for Microelectronic Packaging ................... 465
22 Flip Chip Packaging for Nanoscale Silicon
Logic Devices: Challenges and Opportunities .................................... 491
23 Nanoelectronics Landscape: Application,
Technology, and Economy ..................................................................... 517
Computational NeuroscienceComputational Neuroscience is a collection of recent advances in
computational studies in neuroscience research that practically applies to a collaborative and integrative environment in
engineering and medical domains. The aim of the author is to address the explosion of interest by academic researchers and practitioners in highly-effective coordination between
computational models and tools and quantitative investigation of neuroscientific data. This is to bridge the vital gap between science and medicine. This book brings together diverse research areas ranging from medical signal processing, image analysis, and data mining to neural network modeling, regulation of gene expression, and brain dynamics. The book is good for researchers from
engineering, computer science, statistics, and mathematics domains as well as medical and biological scientists; and physicians working in scientific research to understand how basic science can be linked with biological systems.
The first six chapters focused on data mining and medical data processing. First chapter, presenting a complete methodological framework based on optimization for reproducing. Second chapter, proposed graph-theoretic models to investigate functional cooperation in the human brain.
Third chapter, proposed a framework for extracting time frequency features from electroencephalographic (EEG) recordings through the use of wavelet analysis.
Fourth chapter, presented an application of independent component analysis (ICA) transformation into Creutzfeldt–Jakob disease.
Fifth chapter discussed a comparison study of classification methods using various data preprocessing procedures applied to functional magnetic resonance imaging (fMRI) data for the detection of brain activation.
Sixth chapter discussed the most well known methods in biclustering applied to a neuroscientific application in evaluating the therapeutic intervention using vagus nerve stimulation treatment for patients with epilepsy.
Seventh chapter proposed a genetic classifier used in the study of gene expression regulation.
The second theme includes five chapters that provide reviews and challenges in brain modeling in respect of human behavior and brain disease. Eighth chapter provided a review of the inverse source localization problem for
neuroelectromagnetic source imaging of brain dynamics.
Ninth chapter proposed an approach based on the queuing theory and reinforcement learning for modeling the brain function and interpreting the human behavior.
Tenth and eleventh chapters, suggests deterministic mathematical model for modeling neural networks of voluntary single-joint movement organization in normal subjects as well as patients with Parkinson’s disease.
Twelfth chapter proposed a parametric model for optical time series data of the respiratory
neural network in the brainstem.
Thirteenth chapter give an overview of the closed-loop deep brain stimulation technology.
Fourteenth chapter present a novel approach to
build fine grain models of the human brain with a large number of neurons inspired by recent advances in computing based on DNA modecules.
The third theme includes six chapters that focus on quantitative analyses of EEG recordings to investigate the brain dynamics and neural synchronization. Fifteenth chapter, investigate the synchronization in the neural networks based on information flow, measured by the metric of network transfer entropy, among different brain areas.
Sixteenth chapter, describe an optimization-based model for estimating all Lyapunov exponents to characterize the dynamics of EEG recordings.
Seventeenth chapter, report the potential use of nonlinear dynamics for analyzing EEG recordings to evaluate the efficacy of antiepileptic drugs.
Eighteenth chapter, study the synchronization of EEG recordings using the measures of phase synchronization and cointergrated VAR.
Nineteenth chapter, use the concept of mutual information to measure the coupling strength of EEG recordings in order to evaluate the efficacy of antiepileptic drugs in a very rare brain disease.
In the last chapter, propose a seizure monitoring and alert system to be used in an intensive care unit based on statistical analyses of EEG recordings.
Note: If you like this book, just post your request in the comments.
Magnetic Properties of Antiferromagnetic Oxide Materials: Surfaces, Interfaces, and Thin FilmsThis book was written and devoted to
antiferromagnetic oxides, in surfaces forms and thin films, and in the form of interfaces and multilayers with other
magnetic or nonmagnetic materials. Films and multilayers are important examples of low-dimensionality systems . This field is a great experiment effort in the production of artificial structures. You will find this book that gives the first comprehensive of every topic bringing all together experimental and theoretical methods. The author focused on the study of the magnetic behavior of spatially confined
antiferromagnetic transition-metal-oxide systems when their dimensions are scaled down to nanometric level, with particular emphasis on the growth and the magnetic characterization through different experimental methods and theoretical modeling approaches.
Chapter 1 outlines the magnetic properties of low-dimensional antiferromagnetic transition -metal-oxide systems and contains an overview of the significant physical phenomena that intervene in determining their origin.
Chapter 2 extensively discusses the techniques employed to fabricate multilayer and thin film structures. This
chapter highlights the close relationship existing between the structure and magnetism in low-dimensional antiferromagnetic oxides.
Chapter 3 discusses one of the most widespread experimental techniques giving access to the properties of
antiferromagnetic materials, namely, X-ray absorption and dichroism. This chapter represents a general introduction to X-ray absorption and how it is measured. It discusses the selection rules that give rise to the polarization dependence of X-ray absorption and how information about the magnetic properties of matter can be obtained from them.
Chapter 4 deals with the low-dimensional antiferromagnetic transition-metal oxides as such, describing samples consisting of thin epitaxial layers on nonmagnetic substrates, which are therefore not influenced by magnetic underlayers.
Chapter 5 is devoted to the phenomenon of exchange bias. The central topic of this chapter is the so-called ‘‘domain state model’’ in which exchange bias emerges as a consequence of a net magnetization in the volume and also at the interface of the antiferromagnet stabilized by nonmagnetic defects.
Chapter 6 provides a theoretical discussion of the phenomena (exchange coupling, exchange bias, spin reorientation, magnetic domain structure, etc.) occurring at the interface between a ferromagnetic and an antiferromagnetic material.
Chapter 7 focuses on the experimental investigation of Fe3O4-based ferrimagnet–antiferromagnet multilayers comprising NiO or CoO as model systems for addressing interface morphology and chemical structure, anisotropy, interlayer exchange coupling, and how these mechanisms affect the overall magnetic properties of the multilayers.
Chapter 8 presents an extensive X-ray microscopy study of the micromagnetic structure in exchange-coupled interfaces constituted by a ferromagnetic metal and an antiferromagnetic oxide.
See Contents Below:1 Low-Dimensional Antiferromagnetic Oxides : An Overview 1
Marco Finazzi, Lamberto Du` o, and Franco Ciccacci
1.1 Introduction 1
1.2 Finite-Size Effects on the Magnetic Ordering Temperature 2
1.3 AFM Anisotropy 6
1.3.1 Magnetocrystal Anisotropy 7
1.3.2 Dipolar Anisotropy 7
1.4 Interlayer Coupling in AFM–FM Bilayers and Multilayers 9
1.4.1 AFM–FM Interface Coupling 9
1.4.2 Coupling between FM Layers Separated by an AFM Oxide Spacer 12
1.5 Micromagnetic Structure at AFM–FM Interfaces 14
1.6 Applications 17
1.7 Conclusions 18
References 18
2 Growth of Antiferromagnetic Oxide Thin Films 25
Sergio Valeri, Salvatore Altieri, and Paola Luches
2.1 Introduction 25
2.2 Nickel Oxide 29
2.2.1 Ultrathin NiO Layers 29
2.2.2 Thick NiO Films 35
2.3 Cobalt Oxide 40
2.3.1 Ultrathin CoO Layers 40
2.3.2 Thick CoO Films 43
2.4 Other Oxides 47
2.4.1 MnO(001) 47
2.4.2 FeO 48
2.4.3 α-Fe2O3 50
2.5 Oxide–Substrate Interface 53
2.6 Polar-Oxide Surfaces 56
2.7 Conclusions and Perspectives 58
Acknowledgments 60
References 61
3 Dichroism in X-ray Absorption for the Study of Antiferromagnetic
Materials 69
Jan Vogel and Maurizio Sacchi
3.1 X-ray Absorption and X-ray Dichroism 70
3.1.1 X-ray Magnetic Circular Dichroism in the One-Electron
Approximation 71
3.1.1.1 Spin-Orbit Coupling in the d-Band 73
3.1.1.2 Core-Hole and Other Many-Body Effects 73
3.1.2 XMCD in the Strongly Correlated Limit: Multiplet Effects 75
3.1.2.1 Ligand Field Atomic Multiplet Calculations 76
3.1.2.2 Charge-Transfer Effects 77
3.2 Sum Rules for X-ray Dichroism 78
3.2.1 Orbital Moment 78
3.2.2 Spin Moment 79
3.2.3 Sum Rule for Linear Dichroism 80
3.3 Experimental Determination of X-ray Absorption 81
3.4 Linear X-ray Dichroism in Rare-Earth Compounds 83
3.4.1 FexTb1−x Amorphous Thin Films 84
3.5 Magnetic Dichroism in TM Oxides 86
3.5.1 Magnetic Linear Dichroism in Thin NiO Films on MgO 86
3.5.1.1 Calculations 87
3.5.1.2 Sample Preparation 89
3.5.1.3 Experiment 89
3.5.1.4 Results 89
3.6 Conclusions 93
References 94
4 Antiferromagnetic Oxide Films on Nonmagnetic Substrates 99
Tjipke Hibma and Maurits W. Haverkort
4.1 Introduction 99
4.2 Electronic Structure of TM Oxides 100
4.2.1 Mott-Hubbard and Charge Transfer Insulators 100
4.2.2 Ligand Field Theory 101
4.2.2.1 Independent Electron Ligand Field Theory 101
4.2.2.2 Multiplet Ligand Field Theory 103
4.2.3 Spin–Orbit Coupling in Cubic Symmetry 103
4.2.3.1 Single Electron in an Open t2g Shell 104
4.2.3.2 d6 and d7 Configurations 105
4.3 Magnetic Structure 106
4.3.1 Magnetic Ordering of MnO, FeO, CoO and NiO 106
4.3.1.1 MnO and NiO 107
4.3.1.2 FeO and CoO 107
4.4 X-ray Absorption Spectroscopy 108
4.4.1 Magnetic Linear Dichroism 110
4.5 Strain 115
4.6 Linear Dichroism Results for AF TM Monoxide Layers 120
4.6.1 XMLD of Epitaxial NiO(100)/MgO layers 120
4.6.2 Ligand-Field-Induced Linear Dichroism in Strained NiO/Ag(100)
Layers 122
4.6.3 Isotropic XAS of CoO 125
4.6.4 Linear Dichroism of Strained CoO Layers 127
4.6.5 Spin Alignment in Strained CoO 131
4.6.6 Electronic Stucture of Strained CoO 132
4.6.7 Strain-Induced Linear Dichroism in MnO Layers 133
4.7 Conclusions 137
Appendix: Polarization and Spin Direction Dependence of the Linear
Dichroism in Nonspherical Symmetry 137
References 140
5 Exchange Bias by Antiferromagnetic Oxides 143
Marian Fecioru-Morariu, Ulrich Nowak, and Gernot G¨untherodt
5.1 Introduction 143
5.2 Theoretical Background 145
5.2.1 Diluted Antiferromagnets in a Magnetic Field 145
5.2.2 Domain-State Model for Exchange Bias 148
5.2.3 Mean-Field Solution of the Domain-State Model 149
5.3 Experiments 156
5.3.1 Antiferromagnetic Oxides: CoO, Co1−y, Co1−xMgxO 156
5.3.2 Exchange Bias between the Ferromagnet Co and the Diluted
Antiferromagnet CoO 161
5.3.2.1 Nonmagnetic Dilution of the Antiferromagnet 162
5.3.2.2 Hysteresis Curves and Uncompensated Magnetic Moments
(Vertical Shift) 164
5.3.2.3 Substitutional versus Structural Defects 165
5.3.2.4 Temperature Dependence 167
5.3.2.5 Thermoremanent Magnetization and Training
Effect 170
5.3.2.6 Cooling-Field Dependence 173
5.3.2.7 Antiferromagnetic Thickness Dependence 174
5.3.2.8 Blocking Temperature Distribution 175
5.4 Model Calculations 178
5.4.1 Modeling of Experimental Data 178
5.4.2 Anisotropy Dependence 181
5.4.3 Structural Dependence 183
5.5 Conclusions 186
References 187
6 Theory of Ferromagnetic–Antiferromagnetic Interface Coupling 191
Alexander I. Morosov and Alexander S. Sigov
6.1 Introduction 191
6.2 Frustrations on the Ferromagnet–Antiferromagnet Interface 192
6.2.1 Uncompensated Surface of the Antiferromagnet 192
6.2.2 Compensated Surface of the Antiferromagnet 194
6.3 Mathematical Model 195
6.4 The Interface between Thick Ferromagnet–Antiferromagnet
Layers 196
6.4.1 Uncompensated Surface of the Antiferromagnet 197
6.4.1.1 R ( f , af ) 197
6.4.1.2 R ( f , af ) 200
6.4.2 Compensated Surface of the Antiferromagnet 201
6.5 A Thin Ferromagnetic (Antiferromagnetic) Layer on a Thick
Antiferromagnetic (Ferromagnetic) Substrate 206
6.5.1 Uncompensated Surface of the Antiferromagnet 206
6.5.1.1 The Case of γaf 1 206
6.5.1.2 A Thin Layer with a Much Higher Exchange Rigidity 213
6.5.2 Compensated Surface of an Antiferromagnetic Substrate 218
6.6 Spin-Valve Ferromagnet–Antiferromagnet–Ferromagnet
System 219
6.6.1 Domain Walls in a Three-Layer System 220
6.6.1.1 γf ,af a/γaf 1 221
6.6.1.2 γf ,af a/γaf 1 222
6.6.2 Phase Diagram 226
6.6.3 Matching Experimental Data? 233
6.7 Conclusion 236
References 236
7 Antiferromagnetic–Ferromagnetic Oxide Multilayers: Fe3O4-Based
Systems as a Model 239
P. J. van der Zaag and Julie A. Borchers
7.1 Introduction 239
7.2 Interface and Structural Effects 240
7.2.1 Chemical and Structural Quality Effects 242
7.2.2 Interface Effects on Magnetic Properties 244
7.2.2.1 Reduced Magnetization and ‘‘Dead’’ Layers at the Interface 244
7.2.2.2 Anisotropy and Interface Anisotropy of Thin Fe3O4 Layers 246
7.2.2.3 The Interface Structure: Antiphase Boundaries 250
7.3 Magnetic Coupling Studies 258
7.3.1 Antiferromagnetic Multilayers 258
7.3.1.1 AF–NM Multilayers: Finite-Size Scaling 258
7.3.1.2 AF–AF Multilayers: Exchange Coupling 261
7.3.2 Antiferromagnetic–Ferromagnetic Coupling 263
7.3.2.1 Exchange Anisotropy 263
7.3.2.2 Dependence on Antiferromagnetic Thickness 266
7.3.2.3 Perpendicular Coupling 269
7.3.2.4 Reduction of the Blocking Temperature 274
7.3.3 Coupling across Intermediary Layers 277
7.3.3.1 Coupling across a Nonmagnetic Layer 277
7.3.3.2 Coupling across an Antiferromagnetic Layer 281
7.3.4 Perpendicular Anisotropy 283
7.4 Properties of Coupled Systems 285
7.4.1 Magnetoresistance Effects 285
7.4.1.1 Tunnel Junctions using Fe3O4–MgO 286
7.4.1.2 Tunnel Junctions using Fe3O4–AlOx 287
7.4.1.3 Tunnel Junctions using Fe3O4–oxide–LSMO 287
7.4.1.4 Tunnel Junctions using a CoFe2O4 Spin Filter 288
7.4.2 Magnetooptical Effects 289
7.5 Conclusions and Outlook 290
Acknowledgments 291
References 291
8 Micromagnetic Structure – Imaging Antiferromagnetic Domains using
Soft X-Ray Microscopy 301
Hendrik Ohldag
8.1 Introduction 301
8.1.1 Origin of Antiferromagnetic Domains 302
8.1.2 Soft X-Ray Spectroscopy 306
8.1.3 Photoemission Electron Microscope 308
8.1.4 Soft X-Ray Dichroism 310
8.2 Antiferromagnetic Domain Imaging using PEEM 313
8.2.1 Imaging Antiferromagnetic Domains and Domain
Walls 313
8.2.2 Magnetism and Crystallography 317
8.3 Antiferromagnetic Domains in Exchange-Coupled
Systems 318
8.3.1 Antiferromagnetic–Ferrmagnetic-Exchange Coupling 319
8.3.2 Magnetic Domains at Interfaces of Antiferromagnets with
Ferromagnets 322
8.3.3 Origin of Spin Reorientation 327
8.4 Temperature Dependence of the Antiferromagnetic Domain
Structure 329
8.5 Antiferromagnetic Domains and Exchange Bias 333
8.5.1 A Quick Look at a Fluoride 333
8.5.2 Magnetic Reversal Mechanism on the Microscopic
Scale 335
8.6 Summary and Outlook 337
References 338
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